| 摘要 |
PURPOSE:To prevent the destruction of sleeve or the deterioration of electric characteristic of the semiconductor device by a method wherein after a semiconductor pellet is preliminarily atached temporarily to the center of an electrode, they are sealed in a glass sleeve. CONSTITUTION:The glass sleeve 2 and the electrode 1a are put in a lower part jig 5. The electrode 1a is lifted up to the upper end face of the sleeve 2 and an adhesive 4 is applied thinly. A jig 7 having a hole at the center of the electrode 1a is put on the jig 5, and the diode pellet 3 is adhered in the hole. The electrode 1a is made to descend, an electrode 1b and a jig 6 is set together, and the electrode and the sleeve are welded. By this constitution, because the pellet 3 locates at the center of the electrode and comes not in contact with the sleeve after the sealing, so that the concentration of stress is not generated, and the destruction of sleeve and the deterioration of characteristic of the element are eliminated. |
