| 摘要 |
PURPOSE:To facilitate work with an even length of a connecting metal filament by providing a groove near a concave section for housing a chip of an insulator substrate crossing an internal lead and connecting a metal layer extending over the bottom of the groove and the bottom of the concave section to the internal lead at the intersection. CONSTITUTION:A concave section 2 having a metal layer 4 is provided on an insulator substrate 3' and a groove 10 is provided near it crossing an internal lead. A part of the metal layer 4 is extended through a conducting groove and connnected to the metal layer 4' on the bottom of the groove 10. A low-melting point glass 9 is provided on the substrate 3' excluding the concave section and the groove 10 and is fixed with the groove 10 crossing the internal lead 6. At the intersection, the metal layer 4' is connected 7' to the internal lead 6 and a lid 8 is sealed with glass 9. With such an arrangement, the length of the connection 7 between the semiconductor chip and the internal lead is almost even thereby improving workability of the connection. |
