| 摘要 |
PURPOSE:To obtain an excellent cooling performance by removing internal pressure changes in a package by a method wherein a separate closed vessel for adjusting the internal pressure changes within the package is connected to the package in which IC elements are housed. CONSTITUTION:A multilayers wiring substrate made of ceramics on which a large number of IC chips are mounted is housed in the vessel 8 in which a cooling liquid 4 of carbon fluoride system is enclosed and the interval pressure 11 is produced. In this construction, the separate vessel 9 similarly enclosed with the cooling liquid 4 is prepared and connected with the vessel 8 each other through a pipe 10 provided on the lower side walls respectively. At this time, an opening is formed on the top of the separate vessel 9 and when the internal pressure 11 in the vessel 8 is increased by steam pressure, the liquid 4 is flowed into the vessel 9 to cause the internal pressure in the vessel 8 to be decreased. Thus, the internal pressure 11 in the vessel 8 is kept constant to elevate a cooling efficiency and uniformly to maintain a characteristic of the IC element. |
