发明名称 SCRUBBING FOR DIEBONDER
摘要 PURPOSE:To improve the quality of the bonding by performing a scrubbing of an adsorption nozzle in a desired direction driven by drive motors set in X and Y axes so as to select a bonding part in the optimum direction and evenly spread the bonding layer. CONSTITUTION:An adsorption nozzle 1 is moved within a slight range while a die 16a is pressed fit on a lead frame. Here, positive or opposite pulse is applied selectively on drive motors set in X and Y axes, it can perform various scrubbing motions. The scrubbing of the nozzle in the optimum direction makes the spreading of a solder, an epoxy adhesive or the like evenly for bonding thereby improving the quality.
申请公布号 JPS56103431(A) 申请公布日期 1981.08.18
申请号 JP19800005302 申请日期 1980.01.22
申请人 SHINKAWA KK 发明人 TERAKADO YOSHIMITSU;HAYAKAWA KAZUHIRO;KAWAGISHI MINORU
分类号 H01L21/52;H01L21/00;H01L21/68 主分类号 H01L21/52
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