| 摘要 |
An apparatus and method for assembling integrated circuits to a printed circuit board wherein integrated circuits with protective carriers are selectively dispensed from a rotary magazine, are removed from the carriers and positioned by the leads on magnetic holders on a continuous conveyor which moves the integrated circuits, thus mounted on the holders, to a lead-forming and trim assembly wherein the leads are bent downwardly and outwardly to form feet and trimmed. Thereafter the integrated circuits are moved, thus mounted on the holders, to a flux-applying assembly wherein flux is applied to the lead feet, then to a solder-applying assembly wherein solder is applied to the lead feet, and then to a program activated X-Y axis table which mounts the printed circuit board. The integrated circuits, with tinned leads, are transferred through magnetic fingers to the printed circuit board wherein electrodes solder the leads to pads on the Board. The leads are bent in a special configuration comprising four bends which assist in positioning the leads on the magnetic holder and enhances the vibrational stress resistance of the integrated circuits on the assembled printed circuit board. Special universal tooling is magnetically held on the X-Y axis table to mount the printed circuit boards in precise location on the table. The entire operation from dispensing to soldering is computer controlled.
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