COOLING MANIFOLD FOR MULTIPLE SOLENOID OPERATED PUNCHING APPARATUS

摘要

A high density solenoid operated multiple punch apparatus to which the invention relates includes a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side. Solenoid elements are mounded in the large bores. A plurality of holes with a diameter smaller than the large bores are aligned with the large bores and extend the remaining distance through the punch head to the bottom side. Push rod elements are slidably disposed in the holes and are actuated by the solenoid elements. The improvement according to the invention includes a cooling system for the punch head which has a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores. A plurality of elongated grooves in the bottom surface of the head are located between rows of the plurality of holes and form a recessed chamber connecting a row of the small bores. A plate is seated in each of the elongated grooves with each plate separating the associated groove into a first manifold chamber located between the plate and the bottom of the groove and a second manifold chamber on the opposite side of the plate. Tubes are disposed in and extend through each of the plates with each tube concentrically located in one of the small bores. Openings are provided to introduce liquid in one of the manifold chambers and remove liquid from the other manifold chamber.