| 摘要 |
PURPOSE:To accomplish highly accurate bonding efficiently by detecting bonding position at the preceding step of the bonding stage to correct it. CONSTITUTION:A frame 1 is sent intermittently along a line 2. As soon as a pellt 4 reaches a detecting stage 9, the position of holes 7a and 7c is detected with ITVs 10 and 11 and the corresponding bonding position 5 are detected with an ITV12 and then memorized. The information memorized is sent to a bonding stage 8. As soon as the pellet 4 reaches the bonding stage 8, the holes 7a and 7c are detected with ITVs 13 and 14 and compared with the position information memorized at the preceding stage whereby the bnding position 5 is indicated to a bonding device. Thus, a conductive film on the frame 1 and a position 5 of the pellet are connected with a wire 6. With such an arrangement, the cycle time of the bonding work can be shortened while the positioning hole and the positioning pin are free from friction thereby enabling highly accurate bonding. |
