| 摘要 |
PURPOSE:To obtain semiconductor device best suited for a camera photometric device by simplifying the structure by a method wherein a photoelectric conversion unit is buried in a concave formed on a chip surface on which a transparent lens is disposed, and means except for the lens are hermietically sealed with opaque resin. CONSTITUTION:The photoelectric conversion unit 2 is buried in the concave formed on a chip 1, electrodes fitted on the conversion unit 2 being connected to lead frames 7 and the lens 8 made of transparent resin or glass is fixedly attached on the photoelectric conversion unit 2 using transparent adhesives. Then, an end of the lead frame is taken outside and the surface of the lens 8 is airtightly sealed over the whole with a sealing substance of epoxy resin, acrylic resin, silicon resin and the like, while being exposed at the opening 10a. |
