发明名称 |
Bonding head |
摘要 |
A thermode (12) of a thermocompression bonding head (11) is adjustably mounted to a frame (35). A bonding tip (26) of the thermode (12) rests against a reference surface (17). After an initial adjustment of the thermode (12) with respect to a bonding platform (37), the bonding tip (26) may be removed from the thermode (12) and replaced by another identical tip (26) without a need for readjusting the thermode (12) with respect to the bonding platform (37). A comparatively large interface surface area between a dovetailed groove (16) and the mating surfaces of the bonding tip (26) and a wedging action of the dovetailed section urging mating surfaces against each other minimize thermal resistance across the interface between the thermode (12) and the bonding tip (26).
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申请公布号 |
US4284466(A) |
申请公布日期 |
1981.08.18 |
申请号 |
US19790104242 |
申请日期 |
1979.12.17 |
申请人 |
WESTERN ELECTRIC CO., INC. |
发明人 |
CHAYKA, GEORGE A.;SCHNEIDER, FRED J. |
分类号 |
B23K20/02;H01L21/603;(IPC1-7):B30B15/02;B30B15/34 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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