| 摘要 |
Method for preparing a flylead from beryllium copper alloy sheet having one side include a solder layer pattern. The method includes the steps of age hardening the beryllium copper alloy sheet, laminating both sides of the sheet with a dry film photoresist, exposing the first side of the laminated alloy sheet to actinic radiation through a mask to record a first pattern comprising the flylead pattern, exposing the second side of the laminated alloy sheet to actinic radiation through a mask to record a second pattern comprising the solder layer pattern, developing the second pattern to expose the alloy sheet surface, electroplating the exposed alloy sheet surface with a solder, relaminating the electroplated second side, developing the first pattern, etching the first pattern into the alloy sheet and removing the remaining photoresist from both sides of the etched alloy sheet.
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