摘要 |
PURPOSE:To obtain a solder made of copper-alloy having brazing characteristic which is almost same or more than that of well known silver solder, by mixing fixed amounts of Zn, Mn, Ag, Sn, Ni and Se to Cu. CONSTITUTION:This solder is made by mixing 7-25% Zn, 5-20% Mn, 15-30% Ag, 2-5% Sn, 1-3% Ni, 0.5-1% Be (however, total of these elements should be more than 60%) and the rest of Cu and unavoidable impurity. Since this solder contains less amount of expensive silver and no harmful elements, such as Cd, etc., it can be manufactured at economical cost and will not give any influences to the human body when brazing. This solder has a wide range applicability to the base metal as the silver solder has. |