| 摘要 |
PURPOSE:To release the substrate and mask without inflicting any damage thereto by making a concave and a convex in one main surface of a base body, providing a hole equal to or larger than the substrate and directed to the other main surface, mounting thereon the mask closely fitted with the substrate, and pressing the same. CONSTITUTION:A jig 1 is viewed as a square from above with its angles 10 and 11 being convex and its angles 12 and 13 concave. A piercing hole 9 from the surface allows a wafer to pass therethrough. When the wafer 4 can not be released from the mask 1 after exposure, the wafer side of the mask 1 is made to face the concave- convex surface of the jig 8 and to contact therewith so as for the wafer to be put in the hole 9 and an outer force is applied to the peripheral part of the mask, whereby a twisting force is applied to the mask to produce a gap allowing easy release of the wafer. In addition, the mask 1 and photosensitive resin on the surface of the wafer are not damaged. |
