| 摘要 |
PURPOSE:To solder all pins simultaneously by connecting the corresponding internal terminal of each electronic part with each group of pins of a lead frame, later sealing the same with resin, cutting it off with a suspension pin alone being left, and bending it. CONSTITUTION:ICs 31...3n are bonded each to a group of terminals corresponding to the group of pins of the frame, and after being sealed with resin 2, they are cut off with suspension pins 51 and 52 alone being left and turned down. Then, they are carried to a soldering device, immersed in the melted solder and soldered to a terminal pin. By this constitution, plural terminals can be soldered in a short time. |
