Method and apparatus for non-destructive testing of beam-lead integrated circuit connections

摘要

A method and apparatus for non-destructive testing of beam-lead integrated circuit connections in which each of the leads from a chip beam-lead device has a pull tab made interval therewith with a weakened area and means for connecting a pull tool thereto to test the bond strength between the individual lead and the conductor to which the lead is bonded to determine if a predetermined bond exist between the lead and the conductor.