发明名称 SUPPORTER FOR SEMICONDUCTOR PELLET
摘要 <p>PURPOSE:To lower the cost of the supporting system, by incorporating the thin resin frame and the extended resin sheet into one entity by heat-sealing. CONSTITUTION:The resin sheet 2 on which the pellets is adhered is extended in four directions. The thin resin frame 5 is mounted on it and the frame and the sheet is incorporated into one entity by heat-sealing. By this method, metallic frame is not needed and the cost can be substantially lowered.</p>
申请公布号 JPS5698837(A) 申请公布日期 1981.08.08
申请号 JP19800001163 申请日期 1980.01.09
申请人 NIPPON ELECTRIC CO 发明人 YAMAJI NOBUYUKI
分类号 H01L21/683;H01L23/14 主分类号 H01L21/683
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