发明名称 BONDING OF UNSATURATED POLYESTER RESIN MOLDING
摘要 PURPOSE:To strongly bond unsaturated polyester resin moldings by a procedure in which a specific selectively adsorptive substance is adhered to an unsaturated polyester resin, the polyester is molded and hardened, the adsorptive substance is removed, and then the unhardened polyester resins are doubled and hardened. CONSTITUTION:An unsaturated polyester resin containing a vinyl monomer (a), e.g., of styrene, etc., and an unsaturated alkyd resin (b) is impregnated into a reinforcing material and then laminated on the surface of molds. Then, a selectively adsorptive substance capable of adsorbing a component (a), e.g., silicone rubber, urethane resin, etc., but incapable of adsorbing a component (b) is adhered to the place to be secondarily bonded of the reinforcing material, molded, and then hardened. Then, the adsorptive substance is removed out and then the hardened resin so deprived of the adsorptive substance is superposed with a reinforcing material impregnated with unhardened unsaturated polyester resin and then hardened.
申请公布号 JPS5698130(A) 申请公布日期 1981.08.07
申请号 JP19800001038 申请日期 1980.01.08
申请人 YANMAA ZOUSEN KK 发明人 SUGIYAMA SABUROU
分类号 C08L67/00;B29C55/00;B29C57/00;B29C65/00;B29C65/70;B29C65/78;B29C70/06;C08F299/04;C08L67/06 主分类号 C08L67/00
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