| 摘要 |
<p>The present invention is directed generally to a mounting structure for semiconductors, and more particularly to a mounting structure for mounting a heat generating triac type semiconductor onto a heat dissipating device. One conventional technique for mounting such semiconductor devices has been to thread a screw or other fastening device through an apertured mounting tab of the device and into the associated heat sink. However, as the screw is tightened, the body portion containing the semiconductor device may tend to turn, causing the protruding electrical leads to become twisted and possible short circuits to be produced. The mounting structure of the present invention comprises a housing of dielectric material. The housing has a body cavity for receiving the body portion of the switching device and for preventing lateral movement thereof' relative to the housing. The depth of the body cavity is slightly greater than the thickness of the body portion of the switching device to receive the complete body portion therein. The housing has a tab cavity for receiving the mounting tab of the switching device, and bias means formed integrally with the tab cavity for biasing the mounting tab outwardly from the housing. Upon securing the housing to the heat sink with the switching device therein, the mounting tab will be biased into intimate heat transmitting contact with the heat sink.</p> |
