| 摘要 |
PURPOSE:To prepare an inexpensive copper-group brazing alloy that has bonding strength equivalent to that of silver solder by combining and including Zn, Ag, Mn, Ni, and Sn by proper amounts. CONSTITUTION:The alloy consists of 25.1-34.9wt% Zn, 10-14.9wt% Ag, 2- 4.9wt% Mn, 1-2wt% Ni, and 0.1-5wt% Sb and Cu for the remainder. This alloy contains a small amount of silver and is inexpensive, excellent in fluidity its bonding strength is superior to the convertional silver solder. Further, no Cd harmful to the human body is contained. |
