| 摘要 |
PURPOSE:To prevent a pellet from cracks due to the difference of a heat expansion coefficient between a base part and the pellet by a method wherein a concave part is installed at a rear side of the base part on which the pellet is placed and the heat radiation of the base part is improved. CONSTITUTION:In a resin sealing type semiconductor device, a base part on which a pellet is placed is composed of a base floor 13' and a wall 14' surrounding the base floor 13'. One or more concave part is installed at the rear side part where pellets are not placed. With this, a heat radiation is improved and a distortion and cracks of a pellet generated from the difference of a heat expansion coefficient between the pellet and the pellet mounting part are prevented. Further, the mechanical strength of the base part, that is, a base ribbon can be retained by the wall part 14'. |
