| 摘要 |
PURPOSE:To perform baking effectively by making distribution of time for drying in a process for sealing the package of the semiconductor device. CONSTITUTION:In the case when the package is sealed, for instance, with glass frit, the temperature is raised up to 350 deg.C or above in dried ambience. By utilizing this condition of high temperature and dryness, baking effect is caused to a semiconductor element and the package together with sealing. By this constitution, the semiconductor device can be manufactured efficiently with no need to provide a special process for baking. |
