发明名称 |
TH MINIMAL GRAIN BOUNDARIES |
摘要 |
A system and method is provided for forming semiconductor tear-drop shaped bodies having minimal grain boundaries. Semiconductor material is melted in a capillary tube at the top of a tower, and forced under gas pressure through a nozzle. Separate semiconductor bodies are formed. They are passed through a free fall path over which a predetermined temperature gradient controls solidification of the bodies. The resultant bodies are tear-drop semiconductor bodies of near uniform size with minimal grain boundaries. |
申请公布号 |
AU517424(B2) |
申请公布日期 |
1981.07.30 |
申请号 |
AU19780033084 |
申请日期 |
1978.02.07 |
申请人 |
TEXAS INSTRUMENTS INC;KILBY JACK ST CLAIR |
发明人 |
J.S. KILBY;W.R. MCKEE;W.A. PORTER |
分类号 |
B22F9/08;C30B11/00;C30B29/60;H01L21/208;H01L31/04 |
主分类号 |
B22F9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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