发明名称 EVALUATING METHOD OF RESIN SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To ensure the observation of defects in a sealing resin, by infiltrating a contrast medium into the sealing resin of a resin sealed semiconductor device by pressurization, and thereafter observing the resin sealed semiconductor device with a fluoroscopic apparatus. CONSTITUTION:A resin sealed semiconductor device 1 is inputted into a contrast medium such as angiography agent 7, which is contained in a container 8 and prevents the transmission of X rays. Then pressure 9 is applied, and the contrast medium 7 is made to infiltrate into a sealing resin 4 of the semiconductor device 1. Thereafter the X rays 6 are projected. The inside of the sealing resin 4 is observed with a fluoroscopic apparatus. When cracks, voids or the like are present in the sealing resin 4, the contrast medium 7, i.e. the angiography agent, is inputted into said defect 5. The X rays 6 are shielded, and a shade is formed. When the defect is overlapped with a frame and the like, the direction of the semiconductor 1 is changed, and the defect 5 can be observed.
申请公布号 JPS6425045(A) 申请公布日期 1989.01.27
申请号 JP19870182704 申请日期 1987.07.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKABAYASHI MASAKAZU
分类号 G01N23/04;H01L21/56;H01L21/66 主分类号 G01N23/04
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