| 摘要 |
<p>A cutting apparatus for slicing semiconductor materials into wafers is disclosed. The cutting apparatus broadly comprises a pair of spaced-apart co-planar rotatable wheels, a continuous metallic band passing over said wheels, means for driving one of said wheels to move said band unidirectionally through a path encompassing said wheels and through a linear cutting region, means for moving the other wheel towards and away from the driven wheel for tensioning the metallic band, workpiece support means stationed in the cutting region adapted to raise a workpiece to the metallic band at a controlled speed, means for supplying an abrasive slurry to said metallic band in the cutting region upstream of the workpiece, and guide-wipers upstream and downstream of the cutting region each comprising a pair of opposed, laterally and linearly offset wipers for dampening lateral motion of the metallic band, maintaining the band in alignment across the workpiece and wiping the band of abrasive slurry before the band passes over the driven wheel.</p> |
