| 摘要 |
PURPOSE:To prevent break of solder to improve airtightness, by providing a groove in upper and lower vessels where the oscillator is stored. CONSTITUTION:Groove 7 is provided in upper and lower vessels 4a and 4b, and vessels 4a and 4b solder 5a and 5b as upper and lower adhesive materials and quartz oscillator 6 are put in the vacuum chamber, and they are heated up to the temperature where the solder is melted, thus sealing vessels tightly. In this case, the melted solder is flowed and gathered in groove 7, and therefore, the solder is prevented from being broken halfway to damage airtightness. Further, the solder is not flowed up to oscillator 6 and does not impede oscillation. |
