发明名称 LEAD FRAME AND PACKAGE FOR ESTABLISHING ELECTRICAL CONNECTIONS TO ELECTRONIC COMPONENTS
摘要 <p>9038 CAN A lead frame stamped and formed from sheet metal and comprising a plurality of contact arms arranged for connection to respective contact areas of an electronic component, each arm having integrally formed therewith a terminal tab for connection to an external conductor, each tab being formed of a plurality of thicknesses of the sheet metal. The lead frame is part of a package in which it has an electronic component mounted thereon with the contact arms and associated terminal members electrically isolated from each other, a substrate of electrically insulating material being bonded to the contact arms, and a housing in the form of a frame surrounding the substrate, component, contact arms and portions of the tabs, with free end portions of the tabs extending outside the housing, there being encapsulating material filling the housing.</p>
申请公布号 CA1106012(A) 申请公布日期 1981.07.28
申请号 CA19780312578 申请日期 1978.10.03
申请人 AMP INCORPORATED 发明人 KELLER, JOSEPH R.
分类号 H01L23/48;H01L21/48;H01L23/053;H01L23/31;H01L23/495;(IPC1-7):05K1/04 主分类号 H01L23/48
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