发明名称 MANUFACTURING OF LEAD FRAME FOR SEMICONDUCTOR
摘要 PURPOSE:To improve work efficiency, by plating regions of one surface and another surface of a lead frame at a time. CONSTITUTION:One surface and another surface of a nonprocessed lead frame 1 is provided with jig bodies 7 and 10, respectively. And these three are joined into a body, mounted on a partial plating device 13 and pushed by a press plate 15. While maintaining this condition, plating liquid is shifted from a plating liquid outlet of the plating device 13 toward a plating region 2 of the lead frame 1. A part of the plating liquid passes through a gap 5 on the lead frame 1, enters even an opening 11 of the jig 10 and contacts a plating region 2' on the lead frame 1.
申请公布号 JPS5691457(A) 申请公布日期 1981.07.24
申请号 JP19790168743 申请日期 1979.12.25
申请人 NIPPON CHEMICAL DENSHI KK 发明人 DEWAKI RIYUUZOU
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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