发明名称 THIN FILM COIL
摘要 PURPOSE:To disuse wiring crossing a coil and to reduce manufacturing cost by allotting a part of a spiral coil formed by layer conductor films to other layer. CONSTITUTION:Conductor films 1, 2 are stacked on a substrate through insulating films. Windows 11-15 are formed at the insulating films on the conductor films 1 to connect the films 1 and 2. A part not connected to the films 2 at the spiral part of the films 1 becomes a terminal 21. The conductor films 1 share a part of the former spiral coil formed by the films 2. The films 2 also share two lead wires 2 serving as mid-point taps. In this way, the pattern of a thin film coil will be improved and manufacturing cost will be reduced.
申请公布号 JPS5691406(A) 申请公布日期 1981.07.24
申请号 JP19790168331 申请日期 1979.12.26
申请人 HITACHI LTD 发明人 HARA SHINICHI;HANAZONO MASANOBU;KAWAKAMI HIROJI;AKIYAMA HIROSHI
分类号 G11B5/31;G11B5/17;H01F17/00 主分类号 G11B5/31
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