发明名称 PACKAGE FOR MICROWAVE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a package for a metal-stopping microwave semiconductor which does not allow occurrence resonance extending over a wide microwave band, by minimizing electric connection between all the elements at stopping sections by using coaxial structure composed of metallic ring and external connection terminal. CONSTITUTION:Base of a package is composed of an alumina frame 2 fixed onto a metallic base 1. A stop section is formed by joining a stop ring 6 onto surface of the alumina frame 2 in an airtight manner. A wire-like connection terminal 3a is pressingly attached between the alumina frame 2 and the stop ring 6 by metallizing process, etc., one of the ends is connected to a 50OMEGA introducing wire 4 and the other end is connected to a strip line 10. The connection terminal 3a has a circular section and is coaxially surrounded by an annular metal 11 grounded to the metallic base 1. As connection of the package is done by the annular metal 11 and the connection terminal 3a, other influences become negligibly small, and therefore, it is possible to avoid resonance.
申请公布号 JPS5691449(A) 申请公布日期 1981.07.24
申请号 JP19790168107 申请日期 1979.12.26
申请人 FUJITSU LTD 发明人 KOSEMURA KINSHIROU;SHIGAKI MASAFUMI;YAMAMURA EIJI;HIDAKA NORIO
分类号 H01L23/12;H01L23/66 主分类号 H01L23/12
代理机构 代理人
主权项
地址