| 摘要 |
<p>PURPOSE:To prevent a filled body from contacting a solder and also to prevent occurrence of distortion and crack, by holding a DIP-type resin sealed body's bottom section by a U-section boat, placing it in opening section of a soldering tank and soldering it to an outside lead using melt-jetting soldering process. CONSTITUTION:A U-section boat 14 made of stainless steel or teflon is placed on a frame body 13 held by an opening edge section 11a of a soldering tank 10, and the boat is provided with a resin-sealed semiconductor 15. By soaking thus arranged holding body in the soldering tank into which molten solder is jetting, an outside lead 18 is soldered. It is possible, by doing so, to prevent a resin-sealed semiconductor from contacting the jetting solder, to avoid occurrence of distortion or crack during soldering operation and also to obtain a good-quality resin-sealed semiconductor.</p> |
