发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To make it possible to form coating of high quality on the surface of a semiconductor element, by attaching net on the internal wall surface of a vacuum chamber excepting the part where a target is set so as to prevent the formation of microfine dust. CONSTITUTION:Nets 6 made of stainless steel etc. are attached by setting metal fittings 7 to the internal wall surface of a vacuum chamber 1 excepting the part corresponding to a target 5. The mesh of the net is about 0.1mm.-3cm in size. The net restrains the release of fine coating formed on the internal wall surface 1b of the vacuum chamber 1 during operation, or on the surface 4a opposite to the target holder 4, hereby the formation of microfine dust in the vacuum chamber 1 is prevented. Hence high-grade fine coating made of desired metal is formed on the surface of material to be treated e.g. semiconductor element 3.
申请公布号 JPS5690975(A) 申请公布日期 1981.07.23
申请号 JP19790168528 申请日期 1979.12.25
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 HAYAKAWA KENJI
分类号 C23C14/34;C23C14/22;C23C14/56 主分类号 C23C14/34
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