| 摘要 |
PURPOSE:To obtain a strong adhesivity of an electrode with a lower cost by employing a laminate of Ag and Au for a metal layer better in the solder wetting property which is formed on a laminated metal layer applied on the back of a semiconductor substrate to construct it. CONSTITUTION:A P type region 2 is diffused into the surface layer section of an N type semicondcutor substrate and an insulator film 4 is applied over the entire surface layer therof including the region. An opening is provided through the insulator film 4 to form the first electrode 5 as an positive electrode contacting the region 2. Then, a highly adhesive metal layer of Ti or Cr is applied on the back of the substrate 3 and a metal layer 7 of Ni or Cu with a good adhesivity to the solder is laid thereupon to make a negative electrode 9. The metal layer herein used is arranged as follows: An Ag layer 81 about 0.3mum thick is applied on the surface contacting the metal layer 7 and covered with a Cu layer 82 about 0.05mum thick. This provides an electrode with a better fluidity of the solder without use of Au. |
