| 摘要 |
<p>PURPOSE:To improve the electric power rating of the optical coupling element by forming integrally heat dissipating fin with a lead frame mounting with a light emitting element when sealing with resin the light emitting element and photodetector and projecting the end together with the external lead wires externally, thereby reducing the thermal resistance thereof. CONSTITUTION:A lead frame 21a mounted with a light emitting element 20 formed of GaAs or the like and a lead frame 21b mounted with a photodetector 22 formed of two power SCR chips are confronted, and light transmissive silicone resin 23 is sealed between the elements 20 and 22. Then, the frames 21a, 21b are sealed with the enclosure 24 formed of epoxy resin or the like while leading externally the external lead 26b, and a heat dissipating plate 27 is buried on the surface of the enclosure 24 of the frame 21b side. In this construction, the fin 25 is integrally formed with the frame 21a, one end 25a is buried in the resin, the other end 25b is projected externally of the enclosure 24, and heat dissipating effect can be thus improved.</p> |
