| 摘要 |
<p>PURPOSE:To perform easily the highly airtight adhesion with pressure of the semiconductor device by a method wherein a semiconductor element being provided with a pair of conductors is surrounded with an insulating cylinder, respective conductor and the insulating cylinder are connected respectively with metal plates and the one side metal plate is fitted by electromagnetic formation. CONSTITUTION:Cathode and anode conductors 2, 3 are made to come in contact with pressure with a diode element 1. The cathode side metal plate 5 is soldered to the insulating cylinder 4 surrounding the element, and the anode side metal plate 8 is fitted up to seal airtightly. When the cup type end edge part of the anode metal plate 8 is to be fitted up to seal airtightly, a forming jig 9 containing a coil 10 is arranged at the circumference of the cup, an instantaneous large current is made to flow in the coil to perform the plastic deformation by the electromagnetic formation generating an electromagnetic field, and is fitted up with pressure. Accordingly the precise and highly airtight fitting up can be performed easily.</p> |
