| 摘要 |
PURPOSE:To uniform a hydrogen gas in the furnace by a method wherein a shielding plate is installed on the way extending from a nozzle for the reduced gas to an exhaust port of the furnace, in the reducing furnace where a reduced gas is ejected from the central part of the furnace body and a semiconductor pellet is applied a solder treatment. CONSTITUTION:A nitrogen gas is ejected from supply ports 4, 5 for the nitrogen gas, curtains are formed by the nitrogen gas at an inlet and outlet of the furnace 1 and then, such a reduced gas as the hydrogen gas is ejected from the nozzle 2 into the furnace 1. The reduced gas ejected into the furnace 1 is discharged in sequence from the exhaust ports 6, 7. At this time, if teflon sheets having an area as large as capable of covering a passage of the furnace 1 is kept hung from the ceiling of the furnace 1 in curtain-shape around the exhaust ports 6, 7, the reduced gas is hindered from moving in and as a result, the concentration of the reduced gas between the teflon sheets 9 is increased and made uniform. By applying a solder treatment in the reducing furnace in this way, a uniform soldering can be attained. |
