| 摘要 |
<p>PURPOSE:To simply and easily attract the wafer chips by means of vacuum by a method wherein the wafer having segmented slit is sticked on a synthetic resin sheet which has satin finished projections on the surface and which is extended. CONSTITUTION:A large number of the satin finished projections are formed on the surface of the soft synthetic resin sheet and sticked with the wafer having segmented slit thereon. When the wafer is divided into the chips 5 separately, with an extension of the synthetic resin sheet 10 and long intervals of the projections, the chips 5 are mounted on tops of the minor projections and also gaps are comparatively enlarged and an adhesive force is decreased. Thus, the chips can simply and easily isolated by only a vacuum chuck without using a special thrust-up device.</p> |
