发明名称 |
THERMAL CONDUCTION MODULE FOR INTEGRATED CIRCUIT CHIPS |
摘要 |
A thermal conduction module for removing heat from one or more chips (12) located therein consists of a housing (18) made of heat conductive materials forming a cap over the chips. The housing contains one or more openings (22), one opposite each of the chips. More than one heat conductive element (26) is included in each of the openings and are free to move independently lengthwise within the opening. The heat conductive elements are spring loaded (27) so that the end of each element contacts the associated chip. Side springs (29) are located between the sides of adjacent heat conductive elements forcing them mutually away from one another and into contact with the wall of the opening (22). |
申请公布号 |
EP0031448(A3) |
申请公布日期 |
1981.07.15 |
申请号 |
EP19800107222 |
申请日期 |
1980.11.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GUPTA, OMKARNATH RAMNATH |
分类号 |
H01L23/433;(IPC1-7):01L23/42 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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