| 摘要 |
PURPOSE:To shorten the delay time, and to improve the efficiency of mounting by integrating and forming logical blocks including logical circuits at different logical levels such as an ECL, a CMOS, etc., on the same chip and operating the logical blocks by a power supply having the same potential. CONSTITUTION:An ECL circuit block 401, a bipolar-CMOS circuit block 402 and a CMOS circuit block 403 are connected by interface circuits 404. Input/ output circuits 405 at different input/output signal levels are connected to the blocks 401, 403. A first power supply 406 at +5V, a second power supply 408 at -5.2V and a third power supply 407 at OV are fitted as power supplies. These blocks, circuits and power supplies are set up onto a semiconductor substrate (a chip) 409. Circuits inputting and outputting ECL signals are connected to the power lines 407, 408, and circuits inputting and outputting TTL signals and CMOS signals to the power lines 406, 407. The logical block circuits 401, 402, 403 are operated by the power supplies at the same potential though they are composed respectively of logical circuits of different kinds such as an ECL, a bipolar-CMOS and a CMOS. |
