发明名称 ELECTRODEPOSITION OF COPPER
摘要 <p>A composition and method for electrodepositing ductile, bright, well leveled copper deposits from an aqueous acidic copper plating bath having dissolved therein from about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as the reaction product of a polyalkanolamine with an alkylating or quaternization agent. The polyalkanolamine constituent typically is formed as the reaction product of a polyalkylenimine (e.g. polyethylenimine with an alkylene oxide.</p>
申请公布号 CA1105045(A) 申请公布日期 1981.07.14
申请号 CA19780300851 申请日期 1978.04.11
申请人 OXY METAL INDUSTRIES CORPORATION 发明人 CREUTZ, HANS G. (DECEASED);HERR, ROY W.
分类号 C08G73/04;C25D3/38;(IPC1-7):07C93/04;25D3/38;07C141/02 主分类号 C08G73/04
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