| 摘要 |
PURPOSE:To remove burrs efficiently and improve external appearance by a method wherein semiconductor elements with electrodes wire-bonded are glued to lead frames and sealed with resin, ultraviolet rays are irradiated, and excessive resin is removed. CONSTITUTION:When preparing a resin sealing type semiconductor device, semiconductor elements are fastened to lead frames 2, and electrodes on the elements and leads are glued and sealed with resin. Since resin leaks at that time and adheres on the lead frames except resin sealing sections 1 and burrs 3 are formed, ultraviolet rays are irradiated after sealed with resin, and the burrs 3 are removed. Thus, the burrs are removed efficiently, external appearance is improved, and value as products is advanced. |
