发明名称 Method and apparatus for inspecting printed wiring boards
摘要 In order that a slight positional deviation of a plated through hole such as having no substantial effect on the function of wiring should not be optically detected as a defect in a printed wiring board, the plated through hole is recognized as a part of the wiring pattern by making light representative of the plated through hole nearly equal in intensity to reflected light from the wiring pattern. This is achieved by illuminating the printed wiring board with light from the back side or by placing a reflector on the back side of the printed wiring board.
申请公布号 US4277175(A) 申请公布日期 1981.07.07
申请号 US19790074473 申请日期 1979.09.11
申请人 HITACHI, LTD. 发明人 KARASAKI, KOICHI;HARA, YASUHIKO
分类号 G01N21/88;G01N21/93;G01N21/956;G01R31/28;G01R31/309;G06T1/00;H05K3/40;H05K13/08;(IPC1-7):G01B11/00 主分类号 G01N21/88
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