| 摘要 |
PURPOSE:To improve the heat dissipation effect and to make small the size of a housing, by mounting a high frequency power amplifier on the outer surface of the metal-made housing containing a small signal circuit via thermal conductive compound, and fitting the heat sink having the recess covering the amplifier to the housing with thermal conductive compound. CONSTITUTION:A small signal circuit 2 and a low-pass filter 4 are contained in the metal-made housing 5 separately with a partition 8, a control section 1 is fitted in front of the housing 5, and a high-frequency power amplifier 3 is fitted along the outer wall at the back side. In this case, location is made that the heat dissipation part of the amplifier 3 is closely attached to the outer side of the housing 5 via thermal conductive compound. Further, the heat sink 6b having the recess which can cover the amplifier 3 is fitted closely to the rear outer wall surface of the housing 5 via thermal conductive compound by covering the amplifier 3. Further, the heat produced from the amplifier 3 is effectively dissipated to make small the size of the housing 5. |
