| 摘要 |
PURPOSE:To perform positioning of a semiconductor chip highly precisely by a method wherein the joining image on a transparent substrate is conducted through a hole provided in a supporting block and reflectors to a TV camera being arranged vertically. CONSTITUTION:The block 10 holds the transparent substrate 1, and has built-in heater 11 to adhere a chip 2 thermally with pressure. The block 10 has a peep-hole 10a and is equipped on a frame body 12 rotatably freely, and a head 13 absorbing the chip 2 comes down to join the chip. The positioning of the chip 2 on the transparent substrate 1 is performed as follows. The joining image is formed on the vertically provided TV camera 21 through the hole 10a in the block, the reflectors 14, 15 and the lense system, and the block 10 is made to rotate and the head 13 is made to transfer observing the joining face with the monitor TV. By this constitution, the highly precise positioning can be performed. |
