| 摘要 |
PURPOSE:To protect the substrate, the contact surface thereof is turned into SiC, from being polluted by a method wherein the semiconductor substrate is supported with a material having an excellent heatproof and chemicalproof property and the material is suitably shaped so that it is easily attached to or detached from a carrying and processing devices. CONSTITUTION:The holder is made of SiC or by coating SiC on ZrC, C and Al2O3. A frame section is provided on its circumference to prevent the slipping off of the substrate and a radial groove 41a is formed on the peripheral fringe of the concaved section supporting the substrate to simplify the taking out of a wafer. In this constitution, the holder has an excellent heatproof and chemicalproof property and the substrate is not polluted by heat treatment. Also the holder is convenient in carrying the substrate and a processing can be performed without conducting replacement of the substrare, thereby enabling to increase working efficiency. |
