发明名称 MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form a lead frame without deformation in a short time by conducting plating as an island section and the nose of an inner lead section are left as they are connected and detaching the island section and the nose of the inner lead section. CONSTITUTION:The noses of inner lead sections and an island section are connected through press working or etching working, and a lead frame 10 in which inner-lead forming predetermined sections 1A and an island forming prearranged section are unified is manufactured. A required section including the inner-lead forming predetermined sections 1A and the island forming prearranged section 2A is plated 3. The unnecessary section of the plated lead frame 10 is removed through press working or etching working. The finished product of the lead frame 10 is acquired through cutting by press working, etc., by cutting lines 4.
申请公布号 JPS6437854(A) 申请公布日期 1989.02.08
申请号 JP19870194631 申请日期 1987.08.03
申请人 NEC KYUSHU LTD 发明人 SUETAKE KENJI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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