| 摘要 |
PURPOSE:To prevent the flowage of the solder layer of the thin-film type integrated circuit whose electrode patterns have been provided at both ends of a thin film resistance formed on an insulative substrate, by forming each electrode pattern into shape which has a slit or cut. CONSTITUTION:On an insulative substrate 1 of ceramic or the like, a resistance element 2 of a desired pattern is formed of tantalum or the like. Then this is coated with the first conductive layer 3 of NiCr or the like which is adhesive to the resistance element 2 so that the thickness is 200-300Angstrom and the second conductive layer 4 of Au or the like which is adhesive to solder by, e.g., vacuumevaporation. Moreover, these conductive layers are pattened into shape shown in the figure by photoresist method or the like. By said constitution, because a slit 5 or cut 6 has been made in the conductive layers 3 and 4, the flowage of the solder layer can be prevented when it is formed by solder dip. |
