CONTENITORE PER SEMICONDUTTORI

摘要

A semiconductor package 10 has a braze pad region 22 formed near its periphery and a metallization pattern 18 formed on the base 12 for connecting the leads 24 of the lead frame 20 (which is brazed to the base 12) to the semiconductor die 16 which is mounted on the base by bonding means 28. The package 10 has a pressed ceramic base, and the metallization 18 is screen-printed onto the base so that criteria for automatic wire bonding are met. To aid frame alignment an interconnecting member 26 may be employed that is removed from between the leads 24 of frame 20 after the leads 24 have been brazed to the ceramic base 12. A ceramic base having screen-printed metallization thereon may form a leadless chip carrier.