| 摘要 |
PURPOSE:To automatize the transfer of a semiconductor substrate and to improve the workability of moving the substrate along a transferring path provided between accommodating containers for the substrate wherein the substrate is transferred from one accommodating container to the other one. CONSTITUTION:Accommodating containers 11, 12 for a semiconductor substrate 2 having groove-shaped accommodation sections are arranged at the opposite sides of a transferring path 3 having a plurality of groove sections 3a corresponding to the accommodation sections. And the substrate in the container 11 is pushed out at A point by using a pusher 4 wherein one end of the pusher is fixed to a shaft 5 and a revolvable roller 6 at the other end of the pusher is fixed to a shaft 7 and the substrate is transferred as far as B point by attaching the substrate to the roller 6 at the tip end and by rolling the substrate to transfer the substrate to the container 12. In this way, the transfer of the substrate locating between the containers will be automatized and the workability will be improved. The cracking defect of the substrate during transfer work will also be minimized. |
