| 摘要 |
<p>PURPOSE:To satisfactorily and easily strip a protective film by a method wherein a number of noncontact parts which do not touch an adhesive tape and whose areas are microscopic are formed in a distributed manner on the side of the protective film facing the adhesive tape. CONSTITUTION:A protective film C in a bonded region P1 of a semiconductor wafer A is bonded to an adhesive tape B not at a whole area but at a part excluding a number of through holes 4. If a wafer chuck table 1 is lowered together with a frame 2, the protective film C is lowered together with the wafer chuck table 1 because the tension is exerted on the protective film C. A stripping force from the protective film C is exerted on the bonded region P1 between the adhesive tape B and the protective film C; however, because a bonding state at the bonded region P1 is partial, a bonding force is weak. By this setup, the protective film C can be stripped from the adhesive tape B satisfactorily and easily.</p> |
