| 摘要 |
A method of manufacturing an elementary slice provided with a microcircuit(6) and having terminal connections in the form of metallic bumps which ensure the connection of the microcircuit to external circuitry. In order to be able to electrolytically grow the metallic bumps on the land, the latter is series-connected with each other and to a voltage source by conductive strips(7,27) which extends in a zig-zag way over the severing lines. The most important application of the invention lies in the field of manufacturing elementary slices with bubble domain handling structures.
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