发明名称 MOLD RELEASING AGENT FOR SEMICONDUCTOR MOLD RESIN
摘要 <p>PURPOSE:To improve a quality and yielding, by a method wherein at least 1 type of an oxidation-proofing agent, which is selected from ester wax, in which acid value is specified, beta,beta-thiopropionic acid ester, and phosphorous acid ester, is used as a mold releasing agent for mold resin. CONSTITUTION:A kneaded material of each component of the following items (a)-(f) is used as a mold releasing agent for mold resin. That is, 100pts.wt. of cresolnovolak type epoxy resin, whose epoxy equivalent is 235, is used as (a), 50pts.wt. of phenolnovolak resin, whose molecular weight is 700-1,000, is used as (c), 3pts.wt. of tetraphenylphosnium tetraphenylpolate is used as (c). There is used in (d) 153pts.wt. of a silica powder having 200 mesh or less, 1pt.wt. of carnauba wax, whose acid value is below 5mg/g, is used as (e), and 0.01pts.wt. of phenylphenylphosphate is used in (f). These are sufficiently kneaded, and a curing process is performed on a mold at 170 deg.C for 3min.</p>
申请公布号 JPS5678145(A) 申请公布日期 1981.06.26
申请号 JP19790154350 申请日期 1979.11.30
申请人 HITACHI LTD 发明人 TOCHIGI KENJI;HANIYUU YOSHIAKI;HIRATSUKA YUTAKA
分类号 B29B13/00;B29C33/00;B29C33/60;H01L23/29;H01L23/31 主分类号 B29B13/00
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